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A Scalable 3D Heterogeneous Multi-Core Processor with Inductive-Coupling ThruChip Interface
Found in: IEEE Micro
By Yusuke Koizumi,Noriyuki Miura,Eiichi Sasaki,Yasuhiro Take,Hiroki Matsutani,Tadahiro Kuroda,Hideharu Amano,Ryuichi Sakamoto,Mitaro Namiki,Kimiyoshi Usami,Masaaki Kondo,Hiroshi Nakamura
Issue Date:December 2013
pp. 1
A scalable heterogeneous multi-core processor is developed. 3D heterogeneous chip stacking of a general-purpose CPU and reconfigurable multicore accelerators enables various trade-off between performance and energy consumption. The stacked chips interconne...
 
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