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Limits of Parallelism and Boosting in Dim Silicon
Found in: IEEE Micro
By Nathaniel Pinckney,Ronald G. Dreslinski,Korey Sewell,David Fick,Trevor Mudge,Dennis Sylvester,David Blaauw
Issue Date:September 2013
pp. 30-37
Supply-voltage scaling has stagnated in recent technology nodes, leading to so-called dark silicon. To increase overall chip multiprocessor (CMP) performance, it is necessary to improve the energy efficiency of individual tasks so that more tasks can be ex...
 
Centip3De: A 64-Core, 3D Stacked Near-Threshold System
Found in: IEEE Micro
By Ronald G. Dreslinski,David Fick,Bharan Giridhar,Gyouho Kim,Sangwon Seo,Matthew Fojtik,Sudhir Satpathy,Yoonmyung Lee,Daeyeon Kim,Nurrachman Liu,Michael Wieckowski,Gregory Chen,Dennis Sylvester,David Blaauw,Trevor Mudge
Issue Date:March 2013
pp. 8-16
Centip3De uses the synergy between 3D integration and near-threshold computing to create a reconfigurable system that provides both energy-efficient operation and techniques to address single-thread performance bottlenecks. The original Centip3De design is...
 
Centip3De: a many-core prototype exploring 3D integration and near-threshold computing
Found in: Communications of the ACM
By Bharan Giridhar, David Fick, Dennis Sylvester, Gregory Chen, Matthew Fojtik, Ronald G. Dreslinski, Daeyeon Kim, David Blaauw, Gyouho Kim, Michael Wieckowski, Nurrachman Liu, Sangwon Seo, Sudhir Satpathy, Trevor Mudge, Yoonmyung Lee
Issue Date:November 2013
pp. 97-104
Process scaling has resulted in an exponential increase of the number of transistors available to designers. Meanwhile, global interconnect has not scaled nearly as well, because global wires scale only in one dimension instead of two, resulting in fewer, ...
     
Vicis: a reliable network for unreliable silicon
Found in: Proceedings of the 46th Annual Design Automation Conference (DAC '09)
By Andrew DeOrio, David Blaauw, David Fick, Dennis Sylvester, Jin Hu, Valeria Bertacco
Issue Date:July 2009
pp. 812-817
Process scaling has given designers billions of transistors to work with. As feature sizes near the atomic scale, extensive variation and wearout inevitably make margining uneconomical or impossible. The ElastIC project seeks to address this by creating a ...
     
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