AMD Team Wins ITC Best Paper Award
LOS ALAMITOS, Calif., 30 September, 2009 – G. Giles, J. Wang, A. Sehgal, K.J. Balakrishnan, and J. Wingfield of Advanced Micro Devices have been named the recipients of the coveted ITC Ned Kornfield Best Paper Award for their paper entitled, “Test Access Mechanism for Multiple Identical Cores.” This award was renamed five years ago in honor of Nathanial "Ned" Kornfield, ITC's founder and longtime Chairman Emeritus. The AMD paper proposes a new test access mechanism for multiple identical embedded cores, which exploits the identical nature of the cores and modular pipelined circuitry to provide flexible capabilities.
As part of the process of encouraging and appreciating the quality of written and presented work in the technical program, each year, ITC selects the best paper for a US $2,000 award and recognition at the following year's conference. The awards selection committee's decision is based upon the quality of the paper as published in the ITC proceedings, attendee evaluations and program committee recommendations relating to the paper's presentation at a technical session.
This year, the selection committee has also selected two papers for Honorable Mention Awards. These are, “A Method to Generate a Very-Low Distortion, High-Frequency Sine Waveform Using an AWG,” by A. Maeda of Verigy Japan, and “Efficiently Performing Yield Enhancements by Identifying Dominant Physical Root Cause from Test Fail Data,” by M. Sharma, B. Benware, L. Ling, D. Abercrombie, L. Lee, M. Keim, H. Tang, W.T. Cheng, and t.-P.Tai of Mentor Graphics; Y.-J. Chang and R. Lin, UMC; A. Man, AMD.
The first introduces an application method that reduces harmonic distortion and generates a clean sine waveform using the low-cost legacy Arbitrary Waveform Generator (AWG) for testing over 100-MHz high-resolution ADC. The latter presents Axiom, a new technique to efficiently identify the root-cause of an excursion wafer by analyzing production test fail data. Axiom correctly identified the failing physical feature in an excursion wafer produced in 90-nm process.
ITC '08 Program Chair, Professor Nur Touba of University of Texas, Austin, will present the awards in the plenary session of ITC 2009 on Tuesday morning, November 3, at the Austin Convention Center in Austin, Texas.
The International Test Conference (ITC) is sponsored by the Test Technology Technical Council of the IEEE Computer Society and by the Philadelphia Section of the IEEE. This year marks the 40th consecutive conference year for ITC.
From its beginnings as an informal gathering of test engineers in 1970 at Cherry Hill, New Jersey, ITC has grown to become the cornerstone of Test Week activities, which this year include more than 100 technical papers, panels, tutorials, lecture series, workshops, IEEE fringe meetings and important plenary and invited addresses. ITC has a tradition of spirited debate over test issues that continue during breaks and social gatherings. Over 100 companies participate.
ITC 2010 will also be held at the Austin Convention Center in Austin, Texas, on 2-4 November, 2010. Test Week will run 1-5 November, 2010.
Registration information is available online at http://www.itctestweek.org, or through the ITC office at +1 202.973.8665.
About the IEEE Computer Society
With nearly 85,000 members, the IEEE Computer Society is the world’s leading organization of computing professionals. Founded in 1946, and the largest of the 39 IEEE societies, the Computer Society is dedicated to advancing the theory and application of computer and information-processing technology. The Society serves the information and career-development needs of today’s computing researchers and practitioners with technical journals, magazines, conferences, books, conference publications, certifications and online courses.