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Issue No.02 - March/April (vol.26)
ISSN: 0740-7475
From the EIC
Special Issue
Andrew Chang , MediaTek
pp. 14-19
Jean-Pierre Schoellkopf , STMicroelectronics, Crolles, France
pp. 20-29
Other Features
David A. Papa , University of Michigan, Ann Arbor
Igor L. Markov , University of Michigan, Ann Arbor
Kai-hui Chang , Avery Design Systems
pp. 34-43
Wei Zhang , Southern Illinois University Carbondale
pp. 44-51
Dimitris Gizopoulos , University of Piraeus
Mihalis Psarakis , University of Piraeus
Danilo Ravotto , Politecnico di Torino
Andreas Apostolakis , University of Piraeus
pp. 52-63
Yu-Tsao Hsing , National Tsing Hua University
Li-Ming Denq , National Tsing Hua University
pp. 64-73
DATC Newsletter
Book Review
Grant Martin , Tensilica
pp. 76-77
TTTC Newsletter
CEDA Currents
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