X-IDDQ: A Novel Defect Detection Technique Using IDDQ Data

V
VTS
2006
24th IEEE VLSI Test Symposium
Abstract - X-IDDQ: A Novel Defect Detection Technique Using IDDQ Data

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24th IEEE VLSI Test Symposium

Berkeley, California

April 30-May 04

ISBN: 0-7695-2514-8

	ASCII Text	x
	Ashutosh Sharma, Anura P. Jayasumana, Yashwant K. Malaiya, "X-IDDQ: A Novel Defect Detection Technique Using IDDQ Data," VLSI Test Symposium, IEEE, pp. 180-185, 24th IEEE VLSI Test Symposium, 2006.

	BibTex	x
	@article{ 10.1109/VTS.2006.90, author = {Ashutosh Sharma and Anura P. Jayasumana and Yashwant K. Malaiya}, title = {X-IDDQ: A Novel Defect Detection Technique Using IDDQ Data}, journal ={VLSI Test Symposium, IEEE}, volume = {0}, year = {2006}, isbn = {0-7695-2514-8}, pages = {180-185}, doi = {http://doi.ieeecomputersociety.org/10.1109/VTS.2006.90}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - VLSI Test Symposium, IEEE TI - X-IDDQ: A Novel Defect Detection Technique Using IDDQ Data SN - 0-7695-2514-8 SP180 EP185 A1 - Ashutosh Sharma, A1 - Anura P. Jayasumana, A1 - Yashwant K. Malaiya, PY - 2006 KW - Binning KW - IDDQ KW - Defect Correlation KW - Test Optimization KW - Principal Component Analysis. VL - 0 JA - VLSI Test Symposium, IEEE ER -

Ashutosh Sharma, Colorado State University

Anura P. Jayasumana, Colorado State University

Yashwant K. Malaiya, Colorado State University

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/VTS.2006.90

A statistical technique X-IDDQ for extracting defect information from IDDQ data is presented that is effective for detection of defects in ICs. The technique treats the IDDQ measurements in a holistic manner to come up with a statistic X that is highly correlated to the presence of defects. X-IDDQ facilitates binning of ICs and enhances the test process by early identification of faults. The transformation metrics, for evaluating X statistic from IDDQ measurements, obtained using one batch works extremely well for different batches, facilitating its use with manufacturing-line testing.

Index Terms:

Binning, IDDQ, Defect Correlation, Test Optimization, Principal Component Analysis.

Citation:

Ashutosh Sharma, Anura P. Jayasumana, Yashwant K. Malaiya, "X-IDDQ: A Novel Defect Detection Technique Using IDDQ Data," vts, pp.180-185, 24th IEEE VLSI Test Symposium, 2006

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