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24th IEEE VLSI Test Symposium
Berkeley, California
April 30-May 04
ISBN: 0-7695-2514-8
ASCII Text
x 
 
Cheng-Wen Wu, "Session Abstract," VLSI Test Symposium, IEEE, pp. 128-129, 24th IEEE VLSI Test Symposium, 2006.
 
 
BibTex
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@article{ 10.1109/VTS.2006.68,
author = {Cheng-Wen Wu},
title = {Session Abstract},
journal ={VLSI Test Symposium, IEEE},
volume = {0},
year = {2006},
isbn = {0-7695-2514-8},
pages = {128-129},
doi = {http://doi.ieeecomputersociety.org/10.1109/VTS.2006.68},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - CONF
JO - VLSI Test Symposium, IEEE
TI - Session Abstract
SN - 0-7695-2514-8
SP128
EP129
A1 - Cheng-Wen Wu,
PY - 2006
KW - null
VL - 0
JA - VLSI Test Symposium, IEEE
ER -
 
Cheng-Wen Wu, National Tsing Hua University
In nanometer IC manufacturing, testing plays an even more important role than ever. The concern is no longer just defect screening and test coverage, but also reliability and yield. We have three speakers representing three major IC foundries, respectively. They will talk about the challenges they have seen from past experiences, and give directions of the trend regarding test practices, including failure/defect analysis and diagnosis, yield enhancement, DFT, etc.
Citation:
Cheng-Wen Wu, "Session Abstract," vts, pp.128-129, 24th IEEE VLSI Test Symposium, 2006
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