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24th IEEE VLSI Test Symposium
Berkeley, California
April 30-May 04
ISBN: 0-7695-2514-8
ASCII Text
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Yervant Zorian, Bruce Kim, "Session Abstract," VLSI Test Symposium, IEEE, pp. 334-335, 24th IEEE VLSI Test Symposium, 2006.
 
 
BibTex
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@article{ 10.1109/VTS.2006.65,
author = {Yervant Zorian and Bruce Kim},
title = {Session Abstract},
journal ={VLSI Test Symposium, IEEE},
volume = {0},
year = {2006},
isbn = {0-7695-2514-8},
pages = {334-335},
doi = {http://doi.ieeecomputersociety.org/10.1109/VTS.2006.65},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - VLSI Test Symposium, IEEE
TI - Session Abstract
SN - 0-7695-2514-8
SP334
EP335
A1 - Yervant Zorian,
A1 - Bruce Kim,
PY - 2006
KW - null
VL - 0
JA - VLSI Test Symposium, IEEE
ER -
 
Yervant Zorian, Virage Logic
Bruce Kim, University of Alabama
Today?s system-in-package (SiP) technology involves the system integration of multiple die from various technologies into a common package. This session will present SiP applications and their design and test practices from the major SiP companies. The presentations include issues for SiP, and trade-offs between SiP vs. POP vs. SOC integration for cell phone applications.
Citation:
Yervant Zorian, Bruce Kim, "Session Abstract," vts, pp.334-335, 24th IEEE VLSI Test Symposium, 2006
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