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23rd IEEE VLSI Test Symposium (VTS'05)
Resistive Bridge Fault Model Evolution from Conventional to Ultra Deep Submicron Technologies
Palm Springs, California
May 01-May 05
ISBN: 0-7695-2314-5
Ilia Polian, Albert-Ludwigs-University
Sandip Kundu, Intel Corp.
Jean-Marc Galliere, LIRMM - UMII
Piet Engelke, Albert-Ludwigs-University
Michel Renovell, LIRMM - UMII
Bernd Becker, Albert-Ludwigs-University
We present three resistive bridging fault models valid for different CMOS technologies. The models are partitioned into a general framework (which is shared by all three models) and a technology-specific part. The first model is based on Shockley equations and is valid for conventional but not deep submicron CMOS. The second model is obtained by fitting SPICE data. The third resistive bridging fault model uses Berkeley Predictive Technology Model and BSIM4; it is valid for CMOS technologies with feature sizes of 90nm and below, accurately describing non-trivial electrical behavior in that technologies. Experimental results for ISCAS circuits show that the test patterns obtained for the Shockley model are still valid for the Fitted model, but lead to coverage loss under the Predictive model.
Index Terms:
Resistive bridging faults, Deep submicron technology modeling
Citation:
Ilia Polian, Sandip Kundu, Jean-Marc Galliere, Piet Engelke, Michel Renovell, Bernd Becker, "Resistive Bridge Fault Model Evolution from Conventional to Ultra Deep Submicron Technologies," vts, pp.343-348, 23rd IEEE VLSI Test Symposium (VTS'05), 2005
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