P. Nordholz, D. Treytnar, J. Otterstedt, H. Grabinski, D. Niggemeyer, T.W. Williams, "2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores," VLSI Test Symposium, IEEE, pp. 28, 16th IEEE VLSI Test Symposium, 1998.

@article{ 10.1109/VTEST.1998.670845,
author = {P. Nordholz and D. Treytnar and J. Otterstedt and H. Grabinski and D. Niggemeyer and T.W. Williams},
title = {2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores},
journal ={VLSI Test Symposium, IEEE},
volume = {0},
year = {1998},
issn = {1093-0167},
pages = {28},
doi = {http://doi.ieeecomputersociety.org/10.1109/VTEST.1998.670845},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}

TY - CONF
JO - VLSI Test Symposium, IEEE
TI - 2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores
SN - 1093-0167
SP
EP
A1 - P. Nordholz,
A1 - D. Treytnar,
A1 - J. Otterstedt,
A1 - H. Grabinski,
A1 - D. Niggemeyer,
A1 - T.W. Williams,
PY - 1998
VL - 0
JA - VLSI Test Symposium, IEEE
ER -