Low-cost diagnosis of defects in MCM substrate interconnections

V
VTS
1996
14th IEEE VLSI Test Symposium (VTS '96)
Abstract - Low-cost diagnosis of defects in MCM substrate interconnections

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	Similar Articles Articles by B.C. Kim Articles by A. Chatterjee Articles by M. Swaminathan

14th IEEE VLSI Test Symposium (VTS '96)

Princeton, NJ

April 28-May 01

ISBN: 0-8186-7304-4

	ASCII Text	x
	B.C. Kim, A. Chatterjee, M. Swaminathan, "Low-cost diagnosis of defects in MCM substrate interconnections," VLSI Test Symposium, IEEE, pp. 260, 14th IEEE VLSI Test Symposium (VTS '96), 1996.

	BibTex	x
	@article{ 10.1109/VTEST.1996.510866, author = {B.C. Kim and A. Chatterjee and M. Swaminathan}, title = {Low-cost diagnosis of defects in MCM substrate interconnections}, journal ={VLSI Test Symposium, IEEE}, volume = {0}, year = {1996}, isbn = {0-8186-7304-4}, pages = {260}, doi = {http://doi.ieeecomputersociety.org/10.1109/VTEST.1996.510866}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - VLSI Test Symposium, IEEE TI - Low-cost diagnosis of defects in MCM substrate interconnections SN - 0-8186-7304-4 SP EP A1 - B.C. Kim, A1 - A. Chatterjee, A1 - M. Swaminathan, PY - 1996 KW - multichip modules; integrated circuit interconnections; integrated circuit testing; fault diagnosis; fault location; substrates; low-cost diagnosis; MCM substrate interconnections; substrate interconnect defects; fault-dictionary; defect location; defect size VL - 0 JA - VLSI Test Symposium, IEEE ER -

B.C. Kim, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

A. Chatterjee, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

M. Swaminathan, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/VTEST.1996.510866

Consistent with industry needs for low-cost MCM substrate test methods, we have earlier developed a single-probe technique for detecting near-opens and near-shorts in substrate interconnects. In this paper we show how a fault-dictionary can be used to accurately determine defect location, size, etc. Such information may be used to perform repair of MCM substrates.

Index Terms:

multichip modules; integrated circuit interconnections; integrated circuit testing; fault diagnosis; fault location; substrates; low-cost diagnosis; MCM substrate interconnections; substrate interconnect defects; fault-dictionary; defect location; defect size

Citation:

B.C. Kim, A. Chatterjee, M. Swaminathan, "Low-cost diagnosis of defects in MCM substrate interconnections," vts, pp.260, 14th IEEE VLSI Test Symposium (VTS '96), 1996

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