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2006 International Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems (HAPTICS'06)
Thermal Model for Hand-Object Interactions
Alexandria, Virginia
March 25-March 29
ISBN: 1-4244-0226-3
ASCII Text
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Hsin-Ni Ho, Lynette A. Jones, "Thermal Model for Hand-Object Interactions," Haptic Interfaces for Virtual Environment and Teleoperator Systems, International Symposium on, pp. 70, 2006 International Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems (HAPTICS'06), 2006.
 
 
BibTex
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@article{ 10.1109/VR.2006.132,
author = {Hsin-Ni Ho and Lynette A. Jones},
title = {Thermal Model for Hand-Object Interactions},
journal ={Haptic Interfaces for Virtual Environment and Teleoperator Systems, International Symposium on},
volume = {0},
year = {2006},
isbn = {1-4244-0226-3},
pages = {70},
doi = {http://doi.ieeecomputersociety.org/10.1109/VR.2006.132},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - CONF
JO - Haptic Interfaces for Virtual Environment and Teleoperator Systems, International Symposium on
TI - Thermal Model for Hand-Object Interactions
SN - 1-4244-0226-3
SP
EP
A1 - Hsin-Ni Ho,
A1 - Lynette A. Jones,
PY - 2006
KW - Fingerpad surface roughness
KW - hand-object interaction
KW - haptic interface
KW - thermal contact resistance
KW - thermal display
KW - thermal feedback
KW - thermal model
KW - virtual environment
VL - 0
JA - Haptic Interfaces for Virtual Environment and Teleoperator Systems, International Symposium on
ER -
 
Hsin-Ni Ho, MIT, USA
Lynette A. Jones, MIT, USA
A thermal model is proposed that predicts the temperature responses of the skin and material surface during hand-object interactions as well as the heat flux exchanged when the fingerpad makes contact with an object. The surface features of the fingerpad were measured in order to estimate the thermal contact resistance which is included in the model. A simulation based on the model was performed to calculate the thermal responses of the fingerpad as it made contact with a range of materials with varying thermal properties. A thermal measurement system based on an infrared camera has been designed and fabricated to overcome the limitations imposed by the contact thermal sensors. This system will be used to evaluate the validity of the model in predicting the changes in skin temperature during contact.
Index Terms:
Fingerpad surface roughness, hand-object interaction, haptic interface, thermal contact resistance, thermal display, thermal feedback, thermal model, virtual environment
Citation:
Hsin-Ni Ho, Lynette A. Jones, "Thermal Model for Hand-Object Interactions," haptics, pp.70, 2006 International Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems (HAPTICS'06), 2006
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