loading...
 This Article 
   
 Share 
   
 Bibliographic References 
   
 Add to: 
 
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb
 
 Search 
   
20th International Conference on VLSI Design held jointly with 6th International Conference on Embedded Systems (VLSID'07)
On the Impact of Address Space Assignment on Performance in Systems-on-Chip
Bangalore, India
January 06-January 10
ISBN: 0-7695-2762-0
G. Hazari, Indian Institute of Technology Bombay
M. P. Desai, Indian Institute of Technology Bombay
H. Kasture, Indian Institute of Technology Bombay
Today, VLSI systems for computationally demanding applications are being built as Systems-on-Chip (SoCs) with a distributed memory sub-system which is shared by a large number of processing elements. The memory sub-system is a potential performance bottle-neck in the system. In this paper, we consider such a distributed memory sub-system and study the impact of address space distribution on system performance. For a given application on such a system, we introduce the notion of address assignment quality. We show that this assignment quality metric is strongly correlated with memory sub-system throughput over large regions of the design space. We show this using open loop performance modeling of the memory sub-system, and justify this using a queueing and a Markov chain analysis. Further, we develop a detailed memory sub-system model for a multi-processor simulation system built on the Augmint [14] framework. Using two (highly parallel) applications (matrix multiplication and bubble sort) we show that application throughput and assignment quality are strongly correlated over large regions of the design space. We infer that maximization of the assignment quality metric can be a fundamental goal in designing memory sub-systems and in developing applications in such Systems-on-Chip.
Citation:
G. Hazari, M. P. Desai, H. Kasture, "On the Impact of Address Space Assignment on Performance in Systems-on-Chip," vlsid, pp.540-545, 20th International Conference on VLSI Design held jointly with 6th International Conference on Embedded Systems (VLSID'07), 2007
Usage of this product signifies your acceptance of the Terms of Use.