Power Reduction of Functional Units Considering Temperature and Process Variations

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	Similar Articles Articles by Deepa Kannan Articles by Aviral Shrivastava Articles by Sarvesh Bhardwaj Articles by Sarma Vrudhul

21st International Conference on VLSI Design (VLSI Design 2008)

Hyderabad, India

January 04-January 08

ISBN: 0-7695-3083-4

	ASCII Text	x
	Deepa Kannan, Aviral Shrivastava, Sarvesh Bhardwaj, Sarma Vrudhul, "Power Reduction of Functional Units Considering Temperature and Process Variations," VLSI Design, International Conference on, pp. 533-539, 21st International Conference on VLSI Design (VLSI Design 2008), 2008.

	BibTex	x
	@article{ 10.1109/VLSI.2008.81, author = {Deepa Kannan and Aviral Shrivastava and Sarvesh Bhardwaj and Sarma Vrudhul}, title = {Power Reduction of Functional Units Considering Temperature and Process Variations}, journal ={VLSI Design, International Conference on}, volume = {0}, year = {2008}, issn = {1063-9667}, pages = {533-539}, doi = {http://doi.ieeecomputersociety.org/10.1109/VLSI.2008.81}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - VLSI Design, International Conference on TI - Power Reduction of Functional Units Considering Temperature and Process Variations SN - 1063-9667 SP533 EP539 A1 - Deepa Kannan, A1 - Aviral Shrivastava, A1 - Sarvesh Bhardwaj, A1 - Sarma Vrudhul, PY - 2008 VL - 0 JA - VLSI Design, International Conference on ER -

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/VLSI.2008.81

Continuous technology scaling has resulted in an in- crease in both, the power density as well as the variation in device dimensions (process variations) of the manufactured processors. Both power density and process variations have a significant impact on the leakage power. Therefore, power optimization techniques should be sensitive to the variation in leakage power due to both temperature as well as process variations. Operation to Functional Units Binding Mecha- nism (OFBM) is the mechanism to dynamically issue oper- ations to Functional Units (FUs) in superscalar processors. We propose a Leakage-Aware OFBM (LA-OFBM), which is both temperature and process variation aware. Our experi- mental results demostrate that LA-OFBM reduces the mean and standard deviation of the total energy consumption of ALUs by 18%, and 46% respectively, as compared to the traditional OFBM, without any performance penalty.

Citation:

Deepa Kannan, Aviral Shrivastava, Sarvesh Bhardwaj, Sarma Vrudhul, "Power Reduction of Functional Units Considering Temperature and Process Variations," vlsid, pp.533-539, 21st International Conference on VLSI Design (VLSI Design 2008), 2008

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