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Proceedings of the 1988 ACM/IEEE conference on Supercomputing vol. 1
iWarp: an integrated solution to high-speed parallel computing
Orlando, FL, USA
November 14-November 18
ISBN: 0-8186-0882-X
Borkar, Intel Corp., Hillsboro, OR, USA
Cohn, Intel Corp., Hillsboro, OR, USA
Cox, Intel Corp., Hillsboro, OR, USA
Gleason, Intel Corp., Hillsboro, OR, USA
Gross, Intel Corp., Hillsboro, OR, USA
Kung, Intel Corp., Hillsboro, OR, USA
Lam, Intel Corp., Hillsboro, OR, USA
Moore, Intel Corp., Hillsboro, OR, USA
Peterson, Intel Corp., Hillsboro, OR, USA
Pieper, Intel Corp., Hillsboro, OR, USA
Rankin, Intel Corp., Hillsboro, OR, USA
Tseng, Intel Corp., Hillsboro, OR, USA
Sutton, Intel Corp., Hillsboro, OR, USA
Urbanski, Intel Corp., Hillsboro, OR, USA
Webb, Intel Corp., Hillsboro, OR, USA
A description is given of the iWarp architecture and how it supports various communication models and system configurations. The heart of an iWarp system is the iWarp component: a single-chip processor that requires only the addition of memory chips to form a complete system building block, called the iWarp cell. Each iWarp component contains both a powerful computation engine that runs at 20 MFLOPS (million floating-point operations per second) and a high-throughput (320 Mb/s), low-latency (100-150-ns) communication engine for interfacing with other iWarp cells. Because of their strong computation and communication capabilities, the iWarp components provide a versatile building block for high-performance parallel systems ranging from special-purpose systolic arrays to general-purpose distributed memory computers. They can support both fine-grain parallel and coarse-grain distributed computation models simultaneously in the same system. The initial iWarp demonstration system consists of an 8*8 torus of iWarp cells, delivering more than 1.2 GFLOP (billions of FLOPS). It can be expanded to include up to 1024 cells.
Index Terms:
coarse-grain distributed computation models, integrated solution, high-speed parallel computing, iWarp architecture, communication models, system configurations, single-chip processor, memory chips, special-purpose systolic arrays, general-purpose distributed memory computers, fine-grain parallel, 20 MFLOPS
Citation:
Borkar, Cohn, Cox, Gleason, Gross, Kung, Lam, Moore, Peterson, Pieper, Rankin, Tseng, Sutton, Urbanski, Webb, "iWarp: an integrated solution to high-speed parallel computing," sc, vol. 1, pp.330-339, Proceedings of the 1988 ACM/IEEE conference on Supercomputing vol. 1, 1988
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