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International Conference on Parallel Computing in Electrical Engineering, (PARELEC'04)
Providing a High-Performance VIA-Module for LAM/MPI
Dresden, Germany
September 07-September 10
ISBN: 0-7695-2080-4
ASCII Text
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Torsten Mehlan, Wolfgang Rehm, Ralph Engler, Tobias Wenzel, "Providing a High-Performance VIA-Module for LAM/MPI," Parallel Computing in Electrical Engineering, International Conference on, pp. 277-282, International Conference on Parallel Computing in Electrical Engineering, (PARELEC'04), 2004.
 
 
BibTex
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@article{ 10.1109/PCEE.2004.59,
author = {Torsten Mehlan and Wolfgang Rehm and Ralph Engler and Tobias Wenzel},
title = {Providing a High-Performance VIA-Module for LAM/MPI},
journal ={Parallel Computing in Electrical Engineering, International Conference on},
volume = {0},
year = {2004},
isbn = {0-7695-2080-4},
pages = {277-282},
doi = {http://doi.ieeecomputersociety.org/10.1109/PCEE.2004.59},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Parallel Computing in Electrical Engineering, International Conference on
TI - Providing a High-Performance VIA-Module for LAM/MPI
SN - 0-7695-2080-4
SP277
EP282
A1 - Torsten Mehlan,
A1 - Wolfgang Rehm,
A1 - Ralph Engler,
A1 - Tobias Wenzel,
PY - 2004
KW - null
VL - 0
JA - Parallel Computing in Electrical Engineering, International Conference on
ER -
 
Torsten Mehlan, Chemnitz University of Technology, Germany
Wolfgang Rehm, Chemnitz University of Technology, Germany
Ralph Engler, Chemnitz University of Technology, Germany
Tobias Wenzel, Chemnitz University of Technology, Germany
The Virtual Interface Architecture (VIA) was introduced to define a common set of features that are suitable to build high-speed networks. Today the interface of VIA serves as access point to a wide range of system area networks. M-VIA is a software that provides the VIA interface on top of several Ethernet cards. The overhead of TCP/IP protocols is avoided by running M-VIA. To benefit from this performance we developed a LAM/MPI module that utilizes VIA functions to transmit data. The key concepts of data transmission and memory management are presented by this paper. Furthermore a comparative performance analysis is included.
Citation:
Torsten Mehlan, Wolfgang Rehm, Ralph Engler, Tobias Wenzel, "Providing a High-Performance VIA-Module for LAM/MPI," parelec, pp.277-282, International Conference on Parallel Computing in Electrical Engineering, (PARELEC'04), 2004
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