International Symposium on Parallel Computing in Electrical Engineering (PARELEC'06)
Distributed Optimization of Temperature Field for Reliable Construction of Electronic Circuits
Bialystok, Poland
September 13-September 17
ISBN: 0-7695-2554-7
Sequential and distributed implementations of optimization algorithm are validated and applied for the optimization of the temperature field distribution in an electronic circuits. The approximated, analytical solution of heat transfer equation is implemented to determine the temperature distribution in the circuit. The genetic algorithm is applied in the computations of the optimal displacement of the components in the circuit. Three different methods of the task and/or domain partitioning in the distributed algorithm are discussed.