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Fault-Tolerant Design of the IBM Power6 Microprocessor
March/April 2008 (vol. 28 no. 2)
pp. 30-38
ASCII Text
x 
 
Kevin Reick, Pia N. Sanda, Scott Swaney, Jeffrey W. Kellington, Michael Mack, Michael Floyd, Daniel Henderson, "Fault-Tolerant Design of the IBM Power6 Microprocessor," IEEE Micro, vol. 28, no. 2, pp. 30-38, March/April, 2008.
 
 
BibTex
x
 
@article{ 10.1109/MM.2008.22,
author = {Kevin Reick and Pia N. Sanda and Scott Swaney and Jeffrey W. Kellington and Michael Mack and Michael Floyd and Daniel Henderson},
title = {Fault-Tolerant Design of the IBM Power6 Microprocessor},
journal ={IEEE Micro},
volume = {28},
number = {2},
issn = {0272-1732},
year = {2008},
pages = {30-38},
doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2008.22},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Micro
TI - Fault-Tolerant Design of the IBM Power6 Microprocessor
IS - 2
SN - 0272-1732
SP30
EP38
EPD - 30-38
A1 - Kevin Reick,
A1 - Pia N. Sanda,
A1 - Scott Swaney,
A1 - Jeffrey W. Kellington,
A1 - Michael Mack,
A1 - Michael Floyd,
A1 - Daniel Henderson,
PY - 2008
KW - Hot Chips 19
KW - RAS
KW - fault tolerance
KW - fault isolation
KW - reliability
KW - instruction retry
VL - 28
JA - IEEE Micro
ER -
 
Kevin Reick, IBM Systems & Technology Group
Pia N. Sanda, IBM Systems & Technology Group
Scott Swaney, IBM Systems & Technology Group
Jeffrey W. Kellington, IBM Systems & Technology Group
Michael Mack, IBM Systems & Technology Group
Michael Floyd, IBM Systems & Technology Group
Daniel Henderson, IBM Systems & Technology Group
The IBM Power6 microprocessor extends the capabilities of the Power5, dramatically increasing its ability to recover from hard and soft errors without increasing system downtime. The Power6 adds new mainframe-like features for enhanced reliability, availability, and serviceability, including instruction retry and processor failover. Optimized for performance and power, the Power6 implements these RAS enhancements without compromising ultrahigh-frequency operation.

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7. P.J. Meaney et al., "IBM z990 Soft Error Detection and Recovery," IEEE Trans. Device and Materials Reliability, vol. 5, no. 3, Sept. 2005, pp. 419-427.
8. P.N. Sanda et al., "Power6 Processor Soft Error Resilience," IBM J. Research and Development, vol. 51, no. 6, Nov. 2008, pp. 662-632.
9. E.W. Casio et al., "The Proton Irradiation Program at the Northeast Proton Therapy Center," Proc. IEEE Radiation Effects Data Workshop, IEEE Press, 2003, pp. 141-144.

Index Terms:
Hot Chips 19, RAS, fault tolerance, fault isolation, reliability, instruction retry
Citation:
Kevin Reick, Pia N. Sanda, Scott Swaney, Jeffrey W. Kellington, Michael Mack, Michael Floyd, Daniel Henderson, "Fault-Tolerant Design of the IBM Power6 Microprocessor," IEEE Micro, vol. 28, no. 2, pp. 30-38, Mar./Apr. 2008, doi:10.1109/MM.2008.22
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