Using STEAM for Thermal Simulation of Storage Systems

Micro
2006
Issue No. 4 - July/August
Abstract - Using STEAM for Thermal Simulation of Storage Systems

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July/August 2006 (vol. 26 no. 4)

pp. 43-51

	ASCII Text	x
	Sudhanva Gurumurthi, Youngjae Kim, Anand Sivasubramaniam, "Using STEAM for Thermal Simulation of Storage Systems," IEEE Micro, vol. 26, no. 4, pp. 43-51, July/August, 2006.

	BibTex	x
	@article{ 10.1109/MM.2006.84, author = {Sudhanva Gurumurthi and Youngjae Kim and Anand Sivasubramaniam}, title = {Using STEAM for Thermal Simulation of Storage Systems}, journal ={IEEE Micro}, volume = {26}, number = {4}, issn = {0272-1732}, year = {2006}, pages = {43-51}, doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2006.84}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Micro TI - Using STEAM for Thermal Simulation of Storage Systems IS - 4 SN - 0272-1732 SP43 EP51 EPD - 43-51 A1 - Sudhanva Gurumurthi, A1 - Youngjae Kim, A1 - Anand Sivasubramaniam, PY - 2006 KW - STEAM KW - thermal simulation KW - storage systems design KW - heat transfer KW - data transfers VL - 26 JA - IEEE Micro ER -

Sudhanva Gurumurthi, University of Virginia

Youngjae Kim, Pennsylvania State University

Anand Sivasubramaniam, Pennsylvania State University

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MM.2006.84

As demands for higher data transfer rates mount, temperature is joining bandwidth and latency as a key consideration in storage system design. The STEAM simulator lets users abstract the details of low-level recording physics and heat transfer phenomena and facilitates exploration of a large design space of storage configurations under realistic workloads.

Index Terms:

STEAM, thermal simulation, storage systems design, heat transfer, data transfers

Citation:

Sudhanva Gurumurthi, Youngjae Kim, Anand Sivasubramaniam, "Using STEAM for Thermal Simulation of Storage Systems," IEEE Micro, vol. 26, no. 4, pp. 43-51, July/Aug. 2006, doi:10.1109/MM.2006.84

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