Temperature-Aware On-Chip Networks

Micro
2006
Issue No. 1 - January/February
Abstract - Temperature-Aware On-Chip Networks

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January/February 2006 (vol. 26 no. 1)

pp. 130-139

	ASCII Text	x
	Li Shang, Li-Shiuan Peh, Amit Kumar, Niraj K. Jha, "Temperature-Aware On-Chip Networks," IEEE Micro, vol. 26, no. 1, pp. 130-139, January/February, 2006.

	BibTex	x
	@article{ 10.1109/MM.2006.23, author = {Li Shang and Li-Shiuan Peh and Amit Kumar and Niraj K. Jha}, title = {Temperature-Aware On-Chip Networks}, journal ={IEEE Micro}, volume = {26}, number = {1}, issn = {0272-1732}, year = {2006}, pages = {130-139}, doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2006.23}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Micro TI - Temperature-Aware On-Chip Networks IS - 1 SN - 0272-1732 SP130 EP139 EPD - 130-139 A1 - Li Shang, A1 - Li-Shiuan Peh, A1 - Amit Kumar, A1 - Niraj K. Jha, PY - 2006 KW - Temperature-aware KW - on-chip networks KW - thermal KW - thermal modeling KW - simulation framework KW - thermal management VL - 26 JA - IEEE Micro ER -

Li Shang, Queen's University

Li-Shiuan Peh, Princeton University

Amit Kumar, Princeton University

Niraj K. Jha, Princeton University

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MM.2006.23

On-chip networks are becoming increasingly popular as a way to connect high-performance single-chip computer systems, but thermal issues greatly limit network design. This thermal modeling and simulation framework combines with a distributed runtime scheme for thermal management to offer a path to thermally efficient on-chip network design.

Index Terms:

Temperature-aware, on-chip networks, thermal, thermal modeling, simulation framework, thermal management

Citation:

Li Shang, Li-Shiuan Peh, Amit Kumar, Niraj K. Jha, "Temperature-Aware On-Chip Networks," IEEE Micro, vol. 26, no. 1, pp. 130-139, Jan./Feb. 2006, doi:10.1109/MM.2006.23

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