Temperature-Aware Computer Systems: Opportunities and Challenges November/December 2003 (vol. 23 no. 6) pp. 52-61
Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level thermal engineering. These authors define the role of architecture techniques and describe HotSpot, an accurate yet fast thermal model suitable for computer architecture research.
Citation:
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakumar Velusamy, Karthik Sankaranarayanan, David Tarjan, "Temperature-Aware Computer Systems: Opportunities and Challenges," IEEE Micro, vol. 23, no. 6, pp. 52-61, Nov./Dec. 2003, doi:10.1109/MM.2003.1261387 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||