Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies

Design&Test
2010
Issue No. 4 - July/August
Abstract - Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies

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Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies (HTML)

July/August 2010 (vol. 27 no. 4)

pp. 6-9

	ASCII Text	x
	Partha Pratim Pande, Sriram Vangal, "Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies," IEEE Design and Test of Computers, vol. 27, no. 4, pp. 6-9, July/August, 2010.

	BibTex	x
	@article{ 10.1109/MDT.2010.87, author = {Partha Pratim Pande and Sriram Vangal}, title = {Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies}, journal ={IEEE Design and Test of Computers}, volume = {27}, number = {4}, issn = {0740-7475}, year = {2010}, pages = {6-9}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2010.87}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies IS - 4 SN - 0740-7475 SP6 EP9 EPD - 6-9 A1 - Partha Pratim Pande, A1 - Sriram Vangal, PY - 2010 KW - design and test KW - carbon nanotubes KW - conventional metal interconnects KW - interconnect technology KW - interconnection architectures KW - on-chip communication KW - optical communication KW - wireless communications VL - 27 JA - IEEE Design and Test of Computers ER -

Partha Pratim Pande, Washington State University

Sriram Vangal, Intel

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2010.87

This special issue highlights recent investigations of various revolutionary interconnect paradigms as to whether they can deliver on the promise of greater integration, high performance, good scalability, and high energy efficiency in future SoCs and other computing platforms. The selected articles represent a wide range of emerging interconnects, from carbon nanotubes, to optical, RF, and on-chip wireless communications.

Index Terms:

design and test, carbon nanotubes, conventional metal interconnects, interconnect technology, interconnection architectures, on-chip communication, optical communication, wireless communications

Citation:

Partha Pratim Pande, Sriram Vangal, "Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies," IEEE Design and Test of Computers, vol. 27, no. 4, pp. 6-9, July/Aug. 2010, doi:10.1109/MDT.2010.87

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