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Sensor-Driven Reliability and Wearout Management
November/December 2009 (vol. 26 no. 6)
pp. 40-49
Prashant Singh, University of Michigan
Cheng Zhuo, University of Michigan
Eric Karl, Intel Portland Technology Development
David Blaauw, University of Michigan
Dennis Sylvester, University of Michigan

Editor's note:

Gate oxide degradation is a key limiter to semiconductor reliability. Because of variations in gate oxide thickness, however, product reliability is often guaranteed by designing for the worst case. This article describes the use of oxide-degradation sensors and oxide-thickness sensors to reduce these design margins and enhance performance.

—Jim Tschanz, Intel

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Index Terms:
design and test, optimization, oxide breakdown, process variation, reliability, sensor, time-to-failure
Citation:
Prashant Singh, Cheng Zhuo, Eric Karl, David Blaauw, Dennis Sylvester, "Sensor-Driven Reliability and Wearout Management," IEEE Design and Test of Computers, vol. 26, no. 6, pp. 40-49, Nov./Dec. 2009, doi:10.1109/MDT.2009.155
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