Practices in Mixed-Signal and RF IC Testing July/August 2007 (vol. 24 no. 4) pp. 332-339
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2007.143
Most mixed-signal and RF IC testing in industry today involves specification-based testing using ATE. However, some companies employ alternative solutions to ATE testing that use DFT and BIST. This article presents a brief overview of common IC industry practices in mixed-signal testing and RF testing with emphasis on wired and wireless transceiver testing. The authors also discuss the testing challenges of system-in-package (SiP) technology, and present a few practiced DFT solutions.
Index Terms:
built-in tests, DFT, I/O testing, SiP testing, wireless transceiver testing, ATE
Citation:
Salem Abdennadher, Saghir A. Shaikh, "Practices in Mixed-Signal and RF IC Testing," IEEE Design and Test of Computers, vol. 24, no. 4, pp. 332-339, July/Aug. 2007, doi:10.1109/MDT.2007.143 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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