The Need for a SiP Design and Test Infrastructure

	This Article
	PDF HTML RSS feed
	Share
	Email this Article to a friend
	Bibliographic References
	ASCII Text BibTex RefWorks Procite/RefMan/Endnote
	Add to:
	Digg Furl Spurl Blink Simpy Google Del.icio.us Y!MyWeb
	Search
	Similar Articles Articles by Kwang-Ting (Tim) Cheng

The Need for a SiP Design and Test Infrastructure (HTML)

May/June 2006 (vol. 23 no. 3)

pp. 181

	ASCII Text	x
	Kwang-Ting (Tim) Cheng, "The Need for a SiP Design and Test Infrastructure," IEEE Design and Test of Computers, vol. 23, no. 3, pp. 181, May/June, 2006.

	BibTex	x
	@article{ 10.1109/MDT.2006.83, author = {Kwang-Ting (Tim) Cheng}, title = {The Need for a SiP Design and Test Infrastructure}, journal ={IEEE Design and Test of Computers}, volume = {23}, number = {3}, issn = {0740-7475}, year = {2006}, pages = {181}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2006.83}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - The Need for a SiP Design and Test Infrastructure IS - 3 SN - 0740-7475 SP EP EPD - 181 A1 - Kwang-Ting (Tim) Cheng, PY - 2006 KW - SiP KW - system in package VL - 23 JA - IEEE Design and Test of Computers ER -

Kwang-Ting (Tim) Cheng, University of California, Santa Barbara

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2006.83

Although successful and profitable applications have proven themselves in several market segments, significant challenges in system-in-package design and test remain for broader adoption.

Index Terms:

SiP, system in package

Citation:

Kwang-Ting (Tim) Cheng, "The Need for a SiP Design and Test Infrastructure," IEEE Design and Test of Computers, vol. 23, no. 3, pp. 181, May/June 2006, doi:10.1109/MDT.2006.83

Peer Review Notice | Give Us Feedback

Usage of this product signifies your acceptance of the Terms of Use.