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Is System in Package the Panacea for Integration?
May/June 2006 (vol. 23 no. 3)
pp. 256
ASCII Text
x 
 
T.M. Mak, "Is System in Package the Panacea for Integration?," IEEE Design and Test of Computers, vol. 23, no. 3, pp. 256, May/June, 2006.
 
 
BibTex
x
 
@article{ 10.1109/MDT.2006.76,
author = {T.M. Mak},
title = {Is System in Package the Panacea for Integration?},
journal ={IEEE Design and Test of Computers},
volume = {23},
number = {3},
issn = {0740-7475},
year = {2006},
pages = {256},
doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2006.76},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Design and Test of Computers
TI - Is System in Package the Panacea for Integration?
IS - 3
SN - 0740-7475
SP
EP
EPD - 256
A1 - T.M. Mak,
PY - 2006
KW - System in Package
KW - SiP
KW - integration
VL - 23
JA - IEEE Design and Test of Computers
ER -
 
T.M. Mak, Intel
With technology scaling, nature has not been kind to conventional analog circuit design. System in package seems the obvious way to go. But its predecessor was the multichip module, and basically, all the problems are still there. The author discusses where to go from here.
Index Terms:
System in Package, SiP, integration
Citation:
T.M. Mak, "Is System in Package the Panacea for Integration?," IEEE Design and Test of Computers, vol. 23, no. 3, pp. 256, May/June 2006, doi:10.1109/MDT.2006.76
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