Impact of Thermal Gradients on Clock Skew and Testing September/October 2006 (vol. 23 no. 5) pp. 414-424
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2006.126
It is a well-known phenomenon that test-mode switching activity and power consumption can exceed that of mission mode. Thus, testing can induce localized heating and temperature gradients with deleterious results. The authors quantify this problem and propose a novel design scheme to circumvent it.
Index Terms:
clock skew, clock distribution network, temperature, interconnect delay
Citation:
Sebasti? A. Bota, Josep L. Rossell?, Carol de Benito, Ali Keshavarzi, Jaume Segura, "Impact of Thermal Gradients on Clock Skew and Testing," IEEE Design and Test of Computers, vol. 23, no. 5, pp. 414-424, Sep./Oct. 2006, doi:10.1109/MDT.2006.126 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||