Soft-Spot Analysis: Targeting Compound Noise Effects in Nanometer Circuits

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July/August 2005 (vol. 22 no. 4)

pp. 362-375

	ASCII Text	x
	Chong Zhao, Sujit Dey, Xiaoliang Bai, "Soft-Spot Analysis: Targeting Compound Noise Effects in Nanometer Circuits," IEEE Design and Test of Computers, vol. 22, no. 4, pp. 362-375, July/August, 2005.

	BibTex	x
	@article{ 10.1109/MDT.2005.95, author = {Chong Zhao and Sujit Dey and Xiaoliang Bai}, title = {Soft-Spot Analysis: Targeting Compound Noise Effects in Nanometer Circuits}, journal ={IEEE Design and Test of Computers}, volume = {22}, number = {4}, issn = {0740-7475}, year = {2005}, pages = {362-375}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.95}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Soft-Spot Analysis: Targeting Compound Noise Effects in Nanometer Circuits IS - 4 SN - 0740-7475 SP362 EP375 EPD - 362-375 A1 - Chong Zhao, A1 - Sujit Dey, A1 - Xiaoliang Bai, PY - 2005 KW - B.8.1 Reliability KW - Testing KW - and Fault-Tolerance KW - G.4.g Reliability and robustness KW - B.7 Integrated Circuits VL - 22 JA - IEEE Design and Test of Computers ER -

Chong Zhao, University of California, San Diego

Sujit Dey, University of California, San Diego

Xiaoliang Bai, Cadence Design Systems

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2005.95

Soft-spot analysis identifies regions in a circuit that are most susceptible to multiple noise sources and their compound effects so that designers can harden those spots for greater robustness. HSpice simulation validates the methodology's quality, and demonstration on a commercial embedded processor shows its scalability.

Index Terms:

B.8.1 Reliability, Testing, and Fault-Tolerance, G.4.g Reliability and robustness, B.7 Integrated Circuits

Citation:

Chong Zhao, Sujit Dey, Xiaoliang Bai, "Soft-Spot Analysis: Targeting Compound Noise Effects in Nanometer Circuits," IEEE Design and Test of Computers, vol. 22, no. 4, pp. 362-375, July/Aug. 2005, doi:10.1109/MDT.2005.95

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