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Physical Design for 3D System on Package
November/December 2005 (vol. 22 no. 6)
pp. 532-539
ASCII Text
x 
 
Sung Kyu Lim, "Physical Design for 3D System on Package," IEEE Design and Test of Computers, vol. 22, no. 6, pp. 532-539, November/December, 2005.
 
 
BibTex
x
 
@article{ 10.1109/MDT.2005.149,
author = {Sung Kyu Lim},
title = {Physical Design for 3D System on Package},
journal ={IEEE Design and Test of Computers},
volume = {22},
number = {6},
issn = {0740-7475},
year = {2005},
pages = {532-539},
doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.149},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Design and Test of Computers
TI - Physical Design for 3D System on Package
IS - 6
SN - 0740-7475
SP532
EP539
EPD - 532-539
A1 - Sung Kyu Lim,
PY - 2005
KW - 3D packaging
KW - System-On-Package
KW - placement and routing
KW - thermal distribution
KW - decoupling capacitors
KW - crosstalk
VL - 22
JA - IEEE Design and Test of Computers
ER -
 
Sung Kyu Lim, Georgia Institute of Technology
Systems on package constitute a specific class of 3D designs wherein multiple manufactured die are stacked atop one another in a package that embeds both active and passive components. This article considers the problem of physical design for such an environment.
Index Terms:
3D packaging, System-On-Package, placement and routing, thermal distribution, decoupling capacitors, crosstalk
Citation:
Sung Kyu Lim, "Physical Design for 3D System on Package," IEEE Design and Test of Computers, vol. 22, no. 6, pp. 532-539, Nov./Dec. 2005, doi:10.1109/MDT.2005.149
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