Guest Editor's Introduction: ITC Examines How Test Helps the Fittest Survive

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Guest Editor's Introduction: ITC Examines How Test Helps the Fittest Survive (HTML)

November/December 2005 (vol. 22 no. 6)

pp. 565

	ASCII Text	x
	Scott Davidson, "Guest Editor's Introduction: ITC Examines How Test Helps the Fittest Survive," IEEE Design and Test of Computers, vol. 22, no. 6, pp. 565, November/December, 2005.

	BibTex	x
	@article{ 10.1109/MDT.2005.141, author = {Scott Davidson}, title = {Guest Editor's Introduction: ITC Examines How Test Helps the Fittest Survive}, journal ={IEEE Design and Test of Computers}, volume = {22}, number = {6}, issn = {0740-7475}, year = {2005}, pages = {565}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.141}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Guest Editor's Introduction: ITC Examines How Test Helps the Fittest Survive IS - 6 SN - 0740-7475 SP EP EPD - 565 A1 - Scott Davidson, PY - 2005 KW - International Test Conference KW - X-tolerant KW - BIST KW - ATPG KW - yield KW - IDDQ KW - test metrics KW - IC outlier VL - 22 JA - IEEE Design and Test of Computers ER -

Scott Davidson, Sun Microsystems

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2005.141

The theme of the 2005 International Test Conference is "Test: Survival of the Fittest." In conjunction with this year's ITC, this special section examines how test helps the fittest of the industry's chips, boards, and systems survive manufacturing to reach its customers. These articles discuss topics such as X-tolerant test response compaction, reducing yield loss using a constrained ATPG, and using IDDQ testing with today's high background currents.

Index Terms:

International Test Conference, X-tolerant, BIST, ATPG, yield, IDDQ, test metrics, IC outlier

Citation:

Scott Davidson, "Guest Editor's Introduction: ITC Examines How Test Helps the Fittest Survive," IEEE Design and Test of Computers, vol. 22, no. 6, pp. 565, Nov./Dec. 2005, doi:10.1109/MDT.2005.141

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