New Challenges in Delay Testing of Nanometer, Multigigahertz Designs

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May/June 2004 (vol. 21 no. 3)

pp. 241-247

	ASCII Text	x
	T.M. Mak, Angela Krstic, Kwang-Ting (Tim) Cheng, Li-C. Wang, "New Challenges in Delay Testing of Nanometer, Multigigahertz Designs," IEEE Design and Test of Computers, vol. 21, no. 3, pp. 241-247, May/June, 2004.

	BibTex	x
	@article{ 10.1109/MDT.2004.17, author = {T.M. Mak and Angela Krstic and Kwang-Ting (Tim) Cheng and Li-C. Wang}, title = {New Challenges in Delay Testing of Nanometer, Multigigahertz Designs}, journal ={IEEE Design and Test of Computers}, volume = {21}, number = {3}, issn = {0740-7475}, year = {2004}, pages = {241-247}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2004.17}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - New Challenges in Delay Testing of Nanometer, Multigigahertz Designs IS - 3 SN - 0740-7475 SP241 EP247 EPD - 241-247 A1 - T.M. Mak, A1 - Angela Krstic, A1 - Kwang-Ting (Tim) Cheng, A1 - Li-C. Wang, PY - 2004 VL - 21 JA - IEEE Design and Test of Computers ER -

T.M. Mak, Intel

Angela Krstic, University of California, Santa Barbara

Kwang-Ting (Tim) Cheng, University of California, Santa Barbara

Li-C. Wang, University of California, Santa Barbara

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2004.17

Less predictable path delays and many paths with delays close to the clock period are the main trends affecting the delay testability of deep-submicron designs. This article examines the challenges in meeting the quality requirements of gigascale integration, and explores functional testing as well as statistical models and methods that could alleviate some of those problems.

Citation:

T.M. Mak, Angela Krstic, Kwang-Ting (Tim) Cheng, Li-C. Wang, "New Challenges in Delay Testing of Nanometer, Multigigahertz Designs," IEEE Design and Test of Computers, vol. 21, no. 3, pp. 241-247, May/June 2004, doi:10.1109/MDT.2004.17

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