The Next Big Thing in Chipmaking

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The Next Big Thing in Chipmaking (HTML)

April 2007 (vol. 40 no. 4)

pp. 18-20

	ASCII Text	x
	George Lawton, "The Next Big Thing in Chipmaking," Computer, vol. 40, no. 4, pp. 18-20, April, 2007.

	BibTex	x
	@article{ 10.1109/MC.2007.148, author = {George Lawton}, title = {The Next Big Thing in Chipmaking}, journal ={Computer}, volume = {40}, number = {4}, issn = {0018-9162}, year = {2007}, pages = {18-20}, doi = {http://doi.ieeecomputersociety.org/10.1109/MC.2007.148}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - Computer TI - The Next Big Thing in Chipmaking IS - 4 SN - 0018-9162 SP18 EP20 EPD - 18-20 A1 - George Lawton, PY - 2007 KW - chipmaking KW - processor performance VL - 40 JA - Computer ER -

George Lawton

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MC.2007.148

Changing the materials used to make transistors could overcome a substantial roadblock to continuing to use current production processes to shrink transistor elements and thereby increase chip performance, enabling chipmakers to scale down feature sizes through several more generations.

Index Terms:

chipmaking, processor performance

Citation:

George Lawton, "The Next Big Thing in Chipmaking," Computer, vol. 40, no. 4, pp. 18-20, Apr. 2007, doi:10.1109/MC.2007.148

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