ESD-Induced Internal Core Device Failure: New Failure Modes in System-on-Chip (SoC) Designs, invited

I
IWSOC
2005
Fifth International Workshop on System-on-Chip for Real-Time Applications (IWSOC'05)
Abstract - ESD-Induced Internal Core Device Failure: New Failure Modes in System-on-Chip (SoC) Designs, invited

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Fifth International Workshop on System-on-Chip for Real-Time Applications (IWSOC'05)

Banff, Alberta, Canada

July 20-July 24

ISBN: 0-7695-2403-6

	ASCII Text	x
	Yoon Huh, Peter Bendix, Kyungjin Min, Jau-Wen Chen, Ravindra Narayan, Larry D. Johnson, Steven H. Voldman, "ESD-Induced Internal Core Device Failure: New Failure Modes in System-on-Chip (SoC) Designs, invited," System-on-Chip for Real-Time Applications, International Workshop on, pp. 47-53, Fifth International Workshop on System-on-Chip for Real-Time Applications (IWSOC'05), 2005.

	BibTex	x
	@article{ 10.1109/IWSOC.2005.58, author = {Yoon Huh and Peter Bendix and Kyungjin Min and Jau-Wen Chen and Ravindra Narayan and Larry D. Johnson and Steven H. Voldman}, title = {ESD-Induced Internal Core Device Failure: New Failure Modes in System-on-Chip (SoC) Designs, invited}, journal ={System-on-Chip for Real-Time Applications, International Workshop on}, volume = {0}, year = {2005}, isbn = {0-7695-2403-6}, pages = {47-53}, doi = {http://doi.ieeecomputersociety.org/10.1109/IWSOC.2005.58}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - System-on-Chip for Real-Time Applications, International Workshop on TI - ESD-Induced Internal Core Device Failure: New Failure Modes in System-on-Chip (SoC) Designs, invited SN - 0-7695-2403-6 SP47 EP53 A1 - Yoon Huh, A1 - Peter Bendix, A1 - Kyungjin Min, A1 - Jau-Wen Chen, A1 - Ravindra Narayan, A1 - Larry D. Johnson, A1 - Steven H. Voldman, PY - 2005 KW - null VL - 0 JA - System-on-Chip for Real-Time Applications, International Workshop on ER -

Yoon Huh, Global Technology Leader

Peter Bendix, Xpedion Design Systems/Global Technology Leader

Kyungjin Min, Global Technology Leader

Jau-Wen Chen, LSI Logic Corp.

Ravindra Narayan, LSI Logic Corp.

Larry D. Johnson, LSI Logic Corp.

Steven H. Voldman, IBM Microelectronics

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/IWSOC.2005.58

With MOSFET scaling, increased design complexity, and multiple system power domains, ESD failures occur in internal core areas which are not connected to external package pins. A review of the various internal core device failure mechanisms and design recommendations will be presented.

Citation:

Yoon Huh, Peter Bendix, Kyungjin Min, Jau-Wen Chen, Ravindra Narayan, Larry D. Johnson, Steven H. Voldman, "ESD-Induced Internal Core Device Failure: New Failure Modes in System-on-Chip (SoC) Designs, invited," iwsoc, pp.47-53, Fifth International Workshop on System-on-Chip for Real-Time Applications (IWSOC'05), 2005

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