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The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications (IWSOC'03)
The Glue in a Confident SoC Flow
Calgary, Alberta, Canada
June 30-July 02
ISBN: 0-7695-1944-X
John Ferguson, Ph.D., Mentor Graphics Corp. Wilsonville, Oregon

System-on-chip (SoC) design combines individual components created by various design groups, and developed using numerous design styles, methodologies and knowledge levels. Despite the functionality strength realized by this engineering diversity, each component must meet a common standard during development-the physical verification requirements of the foundry or manufacturer.

As designs become larger and more complex, and design rules become more numerous, greater demand is placed on EDA toolmakers to develop tools and methodologies that will not only help streamline the design process with efficiency and accuracy, but will also accommodate various design styles while establishing a common standard across the industry.

Adopting a single physical verification and extraction flow will not only streamline the SoC design process, thereby saving time and resources, but also act as the glue that binds the many components into a cohesive system. Choosing EDA tools that not only meet the rigorous internal verification standards set by the foundry, but also are widely adopted throughout the industry, ensures confident design and data transfer among SoC providers.

Index Terms:
Integration, manufacturing requirements, gold standard, single tool flow, design-to-silicon, designstyle independence, confident data transfer.
Citation:
John Ferguson, Ph.D., "The Glue in a Confident SoC Flow," iwsoc, pp.316, The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications (IWSOC'03), 2003
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