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International Test Conference 2004 (ITC'04)
Charlotte, NC, USA
October 26-October 28
ISBN: 0-7803-8581-0
ASCII Text
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Michael J Smith, "What do you mean my Board Test stinks?," Test Conference, International, pp. 1427, International Test Conference 2004 (ITC'04), 2004.
 
 
BibTex
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@article{ 10.1109/ITC.2004.203,
author = {Michael J Smith},
title = {What do you mean my Board Test stinks?},
journal ={Test Conference, International},
volume = {0},
year = {2004},
issn = {1089-3539},
pages = {1427},
doi = {http://doi.ieeecomputersociety.org/10.1109/ITC.2004.203},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - CONF
JO - Test Conference, International
TI - What do you mean my Board Test stinks?
SN - 1089-3539
SP
EP
A1 - Michael J Smith,
PY - 2004
KW - null
VL - 0
JA - Test Conference, International
ER -
 
Michael J Smith, Teradyne Inc, North Reading, MA. USA
In printed circuit board manufacturing we have generally talked in terms of yield at the end of the manufacturing line. But as the yields has improved over the last 10-15 years from the mid 80?s to the high 90?s yield has become lest relevant and a real measure of quality of the end product become increasingly important.
Citation:
Michael J Smith, "What do you mean my Board Test stinks?," itc, pp.1427, International Test Conference 2004 (ITC'04), 2004
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