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International Test Conference 2004 (ITC'04)
Systematic Defects in Deep Sub-Micron Technologies
Charlotte, NC, USA
October 26-October 28
ISBN: 0-7803-8581-0
Bram Kruseman, Philips Research Laboratories, Netherlands
Ananta Majhi, Philips Research Laboratories, Netherlands
Camelia Hora, Philips Research Laboratories, Netherlands
Stefan Eichenberger, Philips Semiconductors, Netherlands
Johan Meirlevede, Philips Semiconductors, Netherlands
Defects due to process-design interaction have a systematic nature. Therefore they can have a profound impact on yield. The capability to detect (and correct) them is a requirement to continue to follow Moore?s law. Most of the systematic defects are detected during the process development. These defects are detectable with test structures or visual inspection tools. However some process marginalities will only show-up in the topology of ?real? designs. Moreover, these defects are often not detectable with stuck-at testing. We show two examples of process related defects which could only be detected with more advanced test methods such as transition fault testing and low voltage testing. To correct systematic problems, however, one should not only have the capability to detect defects but also to identify them. Our examples show that other tests would have been far more sensitive in detecting systematic issues. Therefore the detection of systematic defects gives new requirements to test suites and can only be achieved with a shift in the position of manufacturing test.
Citation:
Bram Kruseman, Ananta Majhi, Camelia Hora, Stefan Eichenberger, Johan Meirlevede, "Systematic Defects in Deep Sub-Micron Technologies," itc, pp.290-299, International Test Conference 2004 (ITC'04), 2004
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