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International Test Conference 2004 (ITC'04)
On-Chip Mixed-Signal Test Structures Re-used for Board Test
Charlotte, NC, USA
October 26-October 28
ISBN: 0-7803-8581-0
R. Schuttert, Philips Research, Netherlands
D.C.L. Van Geest, Philips Research, Netherlands
A. Kumar, Indian Institute of Technology, Delhi, India
Analogue clusters on boards are tradionally tested in nass production using a bed-of-nails, often combined with functional system test. In general this approach requires additional board area to create test access, is not very flexible and is hard to re-use. On-chip methods provide a solution to overcome these drawbacks and are already widely used in the form of Boundary Scan for digital interconnections. For analogue interconnections also on-chip solutions are available. We analysed the coverage and application of two on-chip methods, IEEE std 1149.4 and the re-usage of existing Design-for-Testability for on-chip Mixed-Signal blocks. It was found that a reduction board test costs as well as test development time can be achieved by using, or rather re-using on-chip alternatives.
Citation:
R. Schuttert, D.C.L. Van Geest, A. Kumar, "On-Chip Mixed-Signal Test Structures Re-used for Board Test," itc, pp.375-383, International Test Conference 2004 (ITC'04), 2004
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