Ninth IEEE International Symposium on Wearable Computers (ISWC'05) Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric Osaka, Japan October 18-October 21 ISBN: 0-7695-2419-2
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ISWC.2005.19
This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.
Citation:
Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl, "Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric," iswc, pp.86-91, Ninth IEEE International Symposium on Wearable Computers (ISWC'05), 2005 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||