IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures (ISVLSI'06) Space-Saving Layout for Passive Components Karlsruhe, Germany March 02-March 03 ISBN: 0-7695-2533-4
The large number of passive components in mobile electronics devices require a large area. In this study, the passive components on the test chip are processed using a commercial CMOS process. The layout area is reduced by superimposing the on-wafer passive components of the basic inductor-capacitor and inductor-resistor circuits. The resonant frequency of the LC circuit using the stacked components matches well with the calculated value of the reference components. The effect of the parasitic components between the stacked passive components is found negligible in the operating frequency range.
Citation:
Paivi H. Karjalainen, Pekka Heino, "Space-Saving Layout for Passive Components," isvlsi, pp.117-121, IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures (ISVLSI'06), 2006 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||