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IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05)
Tampa, Florida
May 11-May 12
ISBN: 0-7695-2365-X
ASCII Text
x 
 
Meng-Chiou Wu, Rung-Bin Lin, "A Comparative Study on Dicing of Multiple Project Wafers," VLSI, IEEE Computer Society Annual Symposium on, pp. 314-315, IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05), 2005.
 
 
BibTex
x
 
@article{ 10.1109/ISVLSI.2005.3,
author = {Meng-Chiou Wu and Rung-Bin Lin},
title = {A Comparative Study on Dicing of Multiple Project Wafers},
journal ={VLSI, IEEE Computer Society Annual Symposium on},
volume = {0},
year = {2005},
isbn = {0-7695-2365-X},
pages = {314-315},
doi = {http://doi.ieeecomputersociety.org/10.1109/ISVLSI.2005.3},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - VLSI, IEEE Computer Society Annual Symposium on
TI - A Comparative Study on Dicing of Multiple Project Wafers
SN - 0-7695-2365-X
SP314
EP315
A1 - Meng-Chiou Wu,
A1 - Rung-Bin Lin,
PY - 2005
KW - null
VL - 0
JA - VLSI, IEEE Computer Society Annual Symposium on
ER -
 
Meng-Chiou Wu, Yuan Ze University
Rung-Bin Lin, Yuan Ze University
This paper carries out a comparative study on the methods of dicing multi-project wafers (MPW). Our dicing method results in using 40% fewer wafers both for low and high volume production.
Citation:
Meng-Chiou Wu, Rung-Bin Lin, "A Comparative Study on Dicing of Multiple Project Wafers," isvlsi, pp.314-315, IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05), 2005
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