9th International Symposium on Quality Electronic Design (isqed 2008)
A Built-in Test and Characterization Method for Circuit Marginality Related Failures
March 17-March 19
ISBN: 978-0-7695-3117-5
With the advent of ultra deep-submicron (UDSM) regime of integrated circuits, the issues with circuit marginality related transient failures are on the rise. An example of such failures is the thermal hotspot-induced ones, which are common when a particular functional unit experiences high switching activity for a considerable duration. In this paper, we propose an on-line hotspot-induced transient failure testing scheme using the built-in self-test (BIST)-based approach which accurately distinguishes such a transient failure from a hard fail and greatly reduces the test cost by dissociating a tester from the test process. We apply the principle of Fmax testing based on frequency shmoo to obtain the maximum safe operating frequency for individual functional units in a chip. We also propose a DFT scheme to characterize the impact of a “hot” unit on its neighborhood and also the influence of a “hot” neighborhood on an otherwise “cold” unit in the reverse way. Thus the proposed architecture extends the capability of the conventional BIST to test a certain class of circuit marginality related transient failures with a very low hardware overhead.
Index Terms:
Circuit Marginality, Built-In Self-Test (BIST), Linear Feedback Shift Register (LFSR), Pseudorandom Pattern Generator (PRPG), Multiple Input Signature Register (MISR), Design-for-Testability (DFT), Fmax testing based on frequency shmoo
Citation:
Alodeep Sanyal, Sandip Kundu, "A Built-in Test and Characterization Method for Circuit Marginality Related Failures," isqed, pp.838-843, 9th International Symposium on Quality Electronic Design (isqed 2008), 2008