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9th International Symposium on Quality Electronic Design (isqed 2008)
Hybrid Integration of Bandgap Reference Circuits Using Silicon ICs and Germanium Devices
March 17-March 19
ISBN: 978-0-7695-3117-5
Low-voltage hybrid silicon-germanium bandgap reference circuits that can defy the voltage scaling limits of those realized in purely silicon-based technologies are implemented. Germanium diodes replace silicon diodes in two conventional bandgap reference circuits fabricated in a 0.18-um Si CMOS process, and experimental results validate the benefit of exploiting a low bandgap material. The output references are measured as 670 mV and 310 mV with 9.3 mV (287 ppm/?C) and 4.6 mV (302 ppm/?C) variation, respectively, over 5 ~ 56 ?C. In addition, the high temperature characteristics limiting the operation range related to low bandgap are investigated.
Index Terms:
bandgap reference, germanium devices, hybrid integration
Citation:
Jae Wook Kim, Boris Murmann, Robert Dutton, "Hybrid Integration of Bandgap Reference Circuits Using Silicon ICs and Germanium Devices," isqed, pp.429-432, 9th International Symposium on Quality Electronic Design (isqed 2008), 2008
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