Analytical Model for the Propagation Delay of Through Silicon Vias

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	Similar Articles Articles by DiaaEldin Khalil Articles by Yehea Ismail Articles by Muhammad Khellah Articles by Tanay Karnik Articles by Vivek De

9th International Symposium on Quality Electronic Design (isqed 2008)

March 17-March 19

ISBN: 978-0-7695-3117-5

	ASCII Text	x
	DiaaEldin Khalil, Yehea Ismail, Muhammad Khellah, Tanay Karnik, Vivek De, "Analytical Model for the Propagation Delay of Through Silicon Vias," Quality Electronic Design, International Symposium on, pp. 553-556, 9th International Symposium on Quality Electronic Design (isqed 2008), 2008.

	BibTex	x
	@article{ 10.1109/ISQED.2008.128, author = {DiaaEldin Khalil and Yehea Ismail and Muhammad Khellah and Tanay Karnik and Vivek De}, title = {Analytical Model for the Propagation Delay of Through Silicon Vias}, journal ={Quality Electronic Design, International Symposium on}, volume = {0}, year = {2008}, isbn = {978-0-7695-3117-5}, pages = {553-556}, doi = {http://doi.ieeecomputersociety.org/10.1109/ISQED.2008.128}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Quality Electronic Design, International Symposium on TI - Analytical Model for the Propagation Delay of Through Silicon Vias SN - 978-0-7695-3117-5 SP553 EP556 A1 - DiaaEldin Khalil, A1 - Yehea Ismail, A1 - Muhammad Khellah, A1 - Tanay Karnik, A1 - Vivek De, PY - 2008 KW - TSV KW - 3D integrated circuits KW - propagation delay model KW - dimensional analysis VL - 0 JA - Quality Electronic Design, International Symposium on ER -

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ISQED.2008.128

This paper explores the modeling of the propagation delay of through silicon vias (TSVs) in 3D integrated circuits. The electrical characteristics and models of the TSVs are very crucial in enabling the analysis and CAD in 3D integrated circuits. In this paper, an analytical model for the propagation delay of the TSV as a function of its physical dimensions is proposed. The presented analytical model is in great agreement with simulations using electromagnetic field solver and lossy transmission line circuit model. Compared to earlier interconnect models, the presented analytical model provides higher accuracy and fidelity in addition to its simplicity. Hence, the presented analytical model is very useful in the analysis of 3D integrated circuits.

Index Terms:

TSV, 3D integrated circuits, propagation delay model, dimensional analysis

Citation:

DiaaEldin Khalil, Yehea Ismail, Muhammad Khellah, Tanay Karnik, Vivek De, "Analytical Model for the Propagation Delay of Through Silicon Vias," isqed, pp.553-556, 9th International Symposium on Quality Electronic Design (isqed 2008), 2008

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