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7th International Symposium on Quality Electronic Design (ISQED'06)
Bringing Manufacturing into Design via Process-Dependent SPICE Models
San Jose, California
March 27-March 29
ISBN: 0-7695-2523-7
ASCII Text
x 
 
S. Tirumala, Y. Mahotin, X. Lin, V. Moroz, L. Smith, S. Krishnamurthy, L. Bomholt, D. Pramanik, "Bringing Manufacturing into Design via Process-Dependent SPICE Models," Quality Electronic Design, International Symposium on, pp. 801-806, 7th International Symposium on Quality Electronic Design (ISQED'06), 2006.
 
 
BibTex
x
 
@article{ 10.1109/ISQED.2006.31,
author = {S. Tirumala and Y. Mahotin and X. Lin and V. Moroz and L. Smith and S. Krishnamurthy and L. Bomholt and D. Pramanik},
title = {Bringing Manufacturing into Design via Process-Dependent SPICE Models},
journal ={Quality Electronic Design, International Symposium on},
volume = {0},
year = {2006},
isbn = {0-7695-2523-7},
pages = {801-806},
doi = {http://doi.ieeecomputersociety.org/10.1109/ISQED.2006.31},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Quality Electronic Design, International Symposium on
TI - Bringing Manufacturing into Design via Process-Dependent SPICE Models
SN - 0-7695-2523-7
SP801
EP806
A1 - S. Tirumala,
A1 - Y. Mahotin,
A1 - X. Lin,
A1 - V. Moroz,
A1 - L. Smith,
A1 - S. Krishnamurthy,
A1 - L. Bomholt,
A1 - D. Pramanik,
PY - 2006
KW - null
VL - 0
JA - Quality Electronic Design, International Symposium on
ER -
 
S. Tirumala, Synopsys Inc, California, USA
Y. Mahotin, Synopsys Inc, California, USA
X. Lin, Synopsys Inc, California, USA
V. Moroz, Synopsys Inc, California, USA
L. Smith, Synopsys Inc, California, USA
S. Krishnamurthy, Synopsys Inc, California, USA
L. Bomholt, Synopsys Inc, California, USA
D. Pramanik, Synopsys Inc, California, USA

This paper describes methodology for constructing compact SPICE models as a function of process parameter variations. The methodology involves global extraction of process-dependant SPICE model parameters from silicon calibrated TCAD simulations. The model is validated by comparing device characteristics from the extracted SPICE parameters with those from TCAD simulations. The analysis demonstrates an excellent goodness of fit over the full range of process parameter variations.

The process-dependant SPICE models allow direct access to process parameter variations in circuit design. The extracted models are employed in rudimentary digital circuits to investigate the delay variation in response to process deviations. The proposed approach significantly improves design-for-manufacturing (DFM) by allowing for accurate design sensitivity analysis and parametric yield assessment, as a function of statistically independent and measurable process variations.

Citation:
S. Tirumala, Y. Mahotin, X. Lin, V. Moroz, L. Smith, S. Krishnamurthy, L. Bomholt, D. Pramanik, "Bringing Manufacturing into Design via Process-Dependent SPICE Models," isqed, pp.801-806, 7th International Symposium on Quality Electronic Design (ISQED'06), 2006
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