Although several types of design verification tools have been recently added to the IC design flow, adequate tools for thermal analysis during the design process still does not exist. In the absence of thermal analysis, not only can excessive hot spots affect reliability but important differences between expected and actual performances may compromise circuit functionality. We have introduced a new physical design verification tool TED, integrating thermal analysis into the design flow. Starting from extracted view this tool automatically verifies for each device its temperature and power density, checks whether maximum ratings are not exceeded. It yields circuit simulation accounting for realistic temperature distribution without modifying device models.