"Enhancing the Silicon-Package Interface Through Their Concurrent Design and Verification," Quality Electronic Design, International Symposium on, pp. 10, Fourth International Symposium on Quality Electronic Design, 2003.

@article{ 10.1109/ISQED.2003.10012,
author = {},
title = {Enhancing the Silicon-Package Interface Through Their Concurrent Design and Verification},
journal ={Quality Electronic Design, International Symposium on},
volume = {0},
year = {2003},
isbn = {0-7695-1881-8},
pages = {10},
doi = {http://doi.ieeecomputersociety.org/10.1109/ISQED.2003.10012},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}

TY - CONF
JO - Quality Electronic Design, International Symposium on
TI - Enhancing the Silicon-Package Interface Through Their Concurrent Design and Verification
SN - 0-7695-1881-8
SP
EP
PY - 2003
KW - null
VL - 0
JA - Quality Electronic Design, International Symposium on
ER -