Fourth International Conference on 3-D Digital Imaging and Modeling (3DIM '03) Optimized Position Sensors for Flying-Spot Active Triangulation Systems Banff, Alberta, Canada October 06-October 10 ISBN: 0-7695-1991-1
A description of the integrated sensors developed for flying-spot active triangulation will be given. All the sensors have been fabricated using standard CMOS technology that allows the monolithic integration of photo-sensors, together with readout circuits, and digital signal processors. Position sensors are classified into two classes that allow a better understanding of the pros and cons of each one. A description of the proposed position sensor that is optimized for accurate and fast 3D acquisition is given alongside some experimental results.
Citation:
J-A Beraldin, F. Blais, M. Rioux, J. Domey, L. Gonzo, F. De Nisi, F. Comper, D. Stoppa, M. Gottardi, A. Simoni, "Optimized Position Sensors for Flying-Spot Active Triangulation Systems," 3dim, pp.29, Fourth International Conference on 3-D Digital Imaging and Modeling (3DIM '03), 2003 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||