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16th International Conference on VLSI Design
The Impact of Bit-Line Coupling and Ground Bounce on CMOS SRAM Performance
New Delhi, India
January 04-January 08
ISBN: 0-7695-1868-0
ASCII Text
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Li Ding, Pinaki Mazumder, "The Impact of Bit-Line Coupling and Ground Bounce on CMOS SRAM Performance," VLSI Design, International Conference on, pp. 234, 16th International Conference on VLSI Design, 2003.
 
 
BibTex
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@article{ 10.1109/ICVD.2003.1183143,
author = {Li Ding and Pinaki Mazumder},
title = {The Impact of Bit-Line Coupling and Ground Bounce on CMOS SRAM Performance},
journal ={VLSI Design, International Conference on},
volume = {0},
year = {2003},
issn = {1063-9667},
pages = {234},
doi = {http://doi.ieeecomputersociety.org/10.1109/ICVD.2003.1183143},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - CONF
JO - VLSI Design, International Conference on
TI - The Impact of Bit-Line Coupling and Ground Bounce on CMOS SRAM Performance
SN - 1063-9667
SP
EP
A1 - Li Ding,
A1 - Pinaki Mazumder,
PY - 2003
KW - null
VL - 0
JA - VLSI Design, International Conference on
ER -
 
Li Ding, The University of Michigan
Pinaki Mazumder, The University of Michigan
In this paper, we provide an analytical framework to study the inter-cell and intra-cell bit-line coupling when it is superimposed with the ground bounce effect and show how those noises impair the performance of SRAM. The impact of noises is expressed in term of a coupling noise degradation factor and a ground bounce degradation factor. We have used analytical techniques to reduce the governing nonlinear ordinary differential equations to some manageable form and have derived very simple formulas for those degradation factors. Experiments have shown that the results obtained using the derived simple formulas are in good agreement with HSPICE simulation.
Citation:
Li Ding, Pinaki Mazumder, "The Impact of Bit-Line Coupling and Ground Bounce on CMOS SRAM Performance," vlsid, pp.234, 16th International Conference on VLSI Design, 2003
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