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13th International Conference on VLSI Design
Silicon Heterostructure Devices for RF Wireless Communication
Calcutta, India
January 04-January 07
ISBN: 0-7695-0487-6
B. Senapati, Indian Institute of Technology
C.K. Maiti, Indian Institute of Technology
N.B. Chakrabarti, Indian Institute of Technology
Wireless communication of high speed data in UHF-microwave region requires RFIC implementation of the front end for low cost consistent with high performance. The suitability of silicon based devices and circuits, in particular Si/SiGe heterostructures, is examined in this paper. Issues related to the change of technology for RFICs are considered and it is shown that scaled SiGe-HBTs satisfy the requirements of transconductance/gain, f$_T$/f$_{max}$ and noise figure. Results of simulation of SiGe-HBT devices, amplifiers using them, and also the noise figure have been presented.
Index Terms:
RFICs, SiGe-HBT, planar inductor, RF amplifier
Citation:
B. Senapati, C.K. Maiti, N.B. Chakrabarti, "Silicon Heterostructure Devices for RF Wireless Communication," vlsid, pp.488, 13th International Conference on VLSI Design, 2000
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