13th International Conference on VLSI Design Silicon Heterostructure Devices for RF Wireless Communication Calcutta, India January 04-January 07 ISBN: 0-7695-0487-6
Wireless communication of high speed data in UHF-microwave region requires RFIC implementation of the front end for low cost consistent with high performance. The suitability of silicon based devices and circuits, in particular Si/SiGe heterostructures, is examined in this paper. Issues related to the change of technology for RFICs are considered and it is shown that scaled SiGe-HBTs satisfy the requirements of transconductance/gain, f$_T$/f$_{max}$ and noise figure. Results of simulation of SiGe-HBT devices, amplifiers using them, and also the noise figure have been presented.
Index Terms:
RFICs, SiGe-HBT, planar inductor, RF amplifier
Citation:
B. Senapati, C.K. Maiti, N.B. Chakrabarti, "Silicon Heterostructure Devices for RF Wireless Communication," vlsid, pp.488, 13th International Conference on VLSI Design, 2000 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||