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8th International Conference on VLSI Design
A differential built-in current sensor design for high speed IDDQ testing
New Delhi, India
January 04-January 07
ISBN: 0-8186-6905-5
J.P. Hurst, Center for Digital Syst. Res., Res. Triangle Inst., Research Triangle Park, NC, USA
A.D. Singh, Center for Digital Syst. Res., Res. Triangle Inst., Research Triangle Park, NC, USA
A new built-in current sensor design for IDDQ testing is presented in this paper. Our design overcomes performance limitations encountered by previous sensors by using a novel differential architecture which allows early and accurate detection of abnormal quiescent current following the switching transient. A test circuit utilizing the sensor in a built-in self-test environment has been fabricated through MOSIS 2.0-micron n-well technology. At clock speeds of up to 31.65 MHz the sensor accurately detects all six of the defects that were implanted in the test chip.
Index Terms:
built-in self test; integrated circuit testing; electric sensing devices; electric current measurement; CMOS digital integrated circuits; design for testability; integrated circuit design; VLSI; built-in current sensor design; high speed IDDQ testing; differential architecture; quiescent current detection; built-in self-test; BIST environment; n-well technology; MOSIS; 2 micron; 31.25 MHz
Citation:
J.P. Hurst, A.D. Singh, "A differential built-in current sensor design for high speed IDDQ testing," vlsid, pp.419, 8th International Conference on VLSI Design, 1995
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