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8th International Conference on VLSI Design
CVD-diamond substrates for multi-chip modules (MCMs)
New Delhi, India
January 04-January 07
ISBN: 0-8186-6905-5
ASCII Text
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H.A. Naseem, A.P. Malshe, R.A. Beera, M.S. Haque, W.D. Brown, L.W. Schaper, "CVD-diamond substrates for multi-chip modules (MCMs)," VLSI Design, International Conference on, pp. 194, 8th International Conference on VLSI Design, 1995.
 
 
BibTex
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@article{ 10.1109/ICVD.1995.512107,
author = {H.A. Naseem and A.P. Malshe and R.A. Beera and M.S. Haque and W.D. Brown and L.W. Schaper},
title = {CVD-diamond substrates for multi-chip modules (MCMs)},
journal ={VLSI Design, International Conference on},
volume = {0},
year = {1995},
isbn = {0-8186-6905-5},
pages = {194},
doi = {http://doi.ieeecomputersociety.org/10.1109/ICVD.1995.512107},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - VLSI Design, International Conference on
TI - CVD-diamond substrates for multi-chip modules (MCMs)
SN - 0-8186-6905-5
SP
EP
A1 - H.A. Naseem,
A1 - A.P. Malshe,
A1 - R.A. Beera,
A1 - M.S. Haque,
A1 - W.D. Brown,
A1 - L.W. Schaper,
PY - 1995
KW - multichip modules; diamond; substrates; polishing; laser beam machining; metallisation; CVD coatings; elemental semiconductors; chemical vapour deposition; CVD-diamond substrates; multichip modules; 3D MCM; chemical vapor deposition; diamond thin films; polishing; planarization; laser drilling; via holes; metallization; dielectric coatings; multilayer interconnects; fabrication; C
VL - 0
JA - VLSI Design, International Conference on
ER -
 
H.A. Naseem, High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
A.P. Malshe, High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
R.A. Beera, High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
M.S. Haque, High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
W.D. Brown, High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
L.W. Schaper, High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
Diamond, the best thermal conductor known, is the ultimate choice as a substrate for three dimensional (3-D) multichip modules (MCMs) in the next generation compact, high power and high speed computers. It has only recently become available as a large area free-standing substrate fabricated using various chemical vapor deposition (CVD) techniques. There are several challenges and technological hurdles which must be resolved before diamond based MCMs becomes a reality. At HiDEC, University of Arkansas, we are actively involved in 1) designing diamond substrate based MCMs, 2) synthesis of diamond thin films and substrates, 3) polishing and planarizing diamond substrates, 4) laser drilling of via holes in diamond and, 5) metallization and dielectric coatings on diamond substrates for multi-layer interconnects (MLI). This paper presents a critical review of novel technologies that have been/are being developed at HiDEC for the fabrication of diamond based MCMs.
Index Terms:
multichip modules; diamond; substrates; polishing; laser beam machining; metallisation; CVD coatings; elemental semiconductors; chemical vapour deposition; CVD-diamond substrates; multichip modules; 3D MCM; chemical vapor deposition; diamond thin films; polishing; planarization; laser drilling; via holes; metallization; dielectric coatings; multilayer interconnects; fabrication; C
Citation:
H.A. Naseem, A.P. Malshe, R.A. Beera, M.S. Haque, W.D. Brown, L.W. Schaper, "CVD-diamond substrates for multi-chip modules (MCMs)," vlsid, pp.194, 8th International Conference on VLSI Design, 1995
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